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COMe-cSP2 / Design Consideration

6 Design Consideration

6.1 Thermal Management

A heat-spreader plate assembly is available from Kontron Embedded Modules for the COMe-cSP2. The heatspreader

plate on top of this assembly is NOT a heat sink. It works as a COM Express™-standard thermal interface to use with a

heat sink or other cooling device.

External cooling must be provided to maintain the heat-spreader plate at proper operating temperatures. Under

worst-case conditions, the cooling mechanism must maintain an ambient air and heat-spreader plate temperature of

60° C or less.

The aluminum slugs and thermal pads on the underside of the heat-spreader assembly implement thermal interfaces

between the heat spreader plate and the major heat-generating components on the COMe-cSP2. About 80 percent of

the power dissipated within the module is conducted to the heat-spreader plate and can be removed by the cooling

solution.

You can use many thermal-management solutions with the heat-spreader plates, including active and passive

approaches. The optimum cooling solution varies, depending on the COM Express® application and environmental

conditions. Please see the COM Express® Design Guide for further information on thermal management.

6.2 Heatspreader Dimensions

Documentation of COMe-cSP2 heatspreader is available in Kontron‘s customer section.

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Kontron COMe-cSP2 Manuel d'utilisateur Page 58