
COMe-cSP2 / Specification
3.3 Mechanical Specification
Module Dimensions
» 95 mm x 95 mm ±0.2 mm
Height on Top
» Maximum approx. 5 mm (without printed circuit board)
» Highest component: memory socket
» Height is depending upon optionally CPU cooler/heatpreader
Height on Bottom
» Maximum approx. 4.06 mm (without printed circuit board)
Mechanical Drawing
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