Kontron COMe-cDC2 Manuel d'utilisateur Page 8
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COMe-cDC2 / Introduction
2 Introduction
2.1 Product Description
The COMe-cDC2 brings latest 45 nm performance generations of Intel® Atom™ N270 processor with 1.6 GHz and the
Intel® 945GSE and ICH7M chipset to a compact 95 x 95 mm module.
Kontron’s new high-efficient power-off state S5 Eco enables ACPI features and lowest power-consumption in soft-off
state – less than 1 mA. Compared to the regular S5 state this means a reduction by at least factor 200! Battery uptime
therefore goes up dramatically.
Like all COM Express® compact modules, it is compatible to the COM Express® basic. Therefore, upgrading existing carrier
boards originally designed for COM Express® basic gets easy and minimizes redesign efforts.
2.2 Naming clarification
COM Express® defines a Computer-On-Module, or COM, with all components necessary for a bootable host computer,
packaged as a super component.
» COMe-bXX# modules are Kontron's COM Express® modules in basic form factor (125mm x 95mm), formerly known
as ETXexpress®
» COMe-cXX# modules are Kontron's COM Express® modules in compact form factor (95mm x 95mm), formerly known
as microETXexpress®
» COMe-mXX# modules are Kontron's COM Express® modules in mini form factor (55mm x 84mm), formerly known as
nanoETXexpress
The product names for Kontron COM Express® Computer-on-Modules consist of a short form of the industry standard
(COMe-), the form factor (b=basic, c=compact, m=mini), the capital letters for the CPU and Chipset Codenames (XX) and
the pin-out type (#) followed by the CPU Name.
2.3 Understanding COM Express® Functionality
All Kontron COM Express® basic and compact modules contain two 220pin connectors; each of it has two rows called Row
A & B on primary connector and Row C & D on secondary connector. COM Express® Computer-on-modules feature the
following maximum amount of interfaces according to the PICMG module Pin-out type:
Feature Pin-Out Type 1 Pin-Out Type 10 Pin-Out Type 2 Pin-Out Type 6
HD Audio
1x 1x 1x 1x
Gbit Ethernet
1x 1x 1x 1x
Serial ATA
4x 4x 4x 4x
Parallel ATA
- - 1x -
PCI
- - 1x -
PCI Express x1
6x 6x 6x 8x
PCI Express x16 (PEG)
- - 1x 1x
USB Client
1x 1x - -
USB 2.0
8x 8x 8x 8x
USB 3.0
- 2x - 4x
VGA
1x - 1x 1x
LVDS
Dual Channel Single Channel Dual Channel Dual Channel
DP++ (SDVO/DP/HDMI/DVI)
1x optional 1x 3x shared with PEG 3x
LPC
1x 1x 1x 1x
External SMB
1x 1x 1x 1x
External I2C
1x 1x 1x 1x
GPIO
8x 8x 8x 8x
SDIO
1x optional 1x optional - -
UART (2-wire COM)
- 2x - 2x
FAN PWM out
- 1x - 1x
8
- COMe-cDC2 1
- » Table of Contents « 3
- 1 User Information 6
- 1.5 Warranty 7
- 1.6 Technical Support 7
- 2 Introduction 8
- 2.5 COM Express® Benefits 9
- 3 Product Specification 10
- Accessories 11
- 3.2 Functional Specification 12
- Connectivity 13
- Misc Interfaces and Features 14
- Kontron Features 14
- Power Features 14
- Supported Operating Systems 14
- 3.3 Block Diagram 15
- 3.4 Electrical Specification 16
- 3.4.5 ATX Mode 17
- 3.4.6 Single Supply Mode 17
- 3.5 Power Control 18
- 3.6.2 Humidity 19
- CE marking 20
- WEEE Directive 20
- Conformal Coating 20
- Shock & Vibration 21
- 3.8 MTBF 22
- 3.9 Mechanical Specification 23
- 3.10 Thermal Management 24
- 3.11 Heatspreader 24
- 3.12 Onboard Fan Connector 25
- 4 Features and Interfaces 27
- 4.2 S5 Eco Mode 28
- 4.4 LPC boot 30
- 4.5 M.A.R.S 31
- 4.6 Fast I2C 32
- 4.7 JIDA16 and JIDA32 33
- 4.8 K-Station 1 34
- 4.9.1 I2C 35
- 4.9.2 Storage 35
- 4.9.3 GPIO 35
- 4.9.4 Hardware Monitor 35
- 4.10.1 I2C 35
- 4.10.2 Storage 36
- 4.10.3 GPIO 36
- 4.10.5 SIO Winbond 83627DHGP 36
- 4.10.6 SIO Winbond 83627HG 37
- Configuration 38
- Time-out events 39
- WDT Signal 39
- 4.13 Flash Backup Feature 40
- 4.14 Speedstep Technology 42
- 4.15 C-States 43
- 4.16 Hyper Threading 44
- 5 System Ressources 46
- 5.3 Memory Area 47
- 5.4 I/O Address Map 48
- 5.7 JILI I2C Bus 48
- 6 Connectors 49
- 6.2 Pinout List 50
- 6.2.2 Connector X1A Row A 51
- COMe-cDC2 / Connectors 52
- 6.2.3 Connector X1A Row B 53
- 6.2.4 Connector X1B Row C 55
- 6.2.5 Connector X1B Row D 57
- 7 BIOS Operation 59
- 7.3 Setup Guide 60
- 7.4 BIOS Setup 62
- 7.4.2 Module Info 63
- Module Software Revisions 64
- Current LVDS Configuration 64
- 7.4.3 Advanced Menu 65
- CPU Configuration 66
- IDE Configuration 67
- IDE Device Submenu 68
- SuperIO Configuration 69
- ACPI Settings 70
- ACPI Cooling Options 71
- PCI Express Configuration 73
- USB Configuration 74
- COMe-cDC2 / BIOS Operation 75
- Hardware Health 76
- Module Hardware Health 77
- Baseboard Hardware Health 78
- Miscellaneous Settings 79
- MARS Interface Configuration 80
- Watchdog 81
- Remote Access Configuration 82
- LAN Controller 83
- GPIO Level Configuration 84
- Trusted Computing 85
- 7.4.4 PCIPnP Menu 86
- 7.4.5 Boot 87
- Boot Setting Configuration 88
- 7.4.6 Security 89
- 7.4.7 Chipset 90
- North Bridge Configuration 91
- Display Control 92
- Internal LVDS Configuration 93
- Southbridge Configuration 94
- LPC Decode Range 95
- 7.4.8 Exit Menu 96
- Corporate Offices 97
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