Kontron COMe-bPC2 Manuel d'utilisateur Page 22
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COMe-bPC2 / Product Specification
3.6 Environmental Specification
3.6.1 Temperature Specification
General Specification Operating Non-operating
Commercial grade 0°C to +60°C -30°C to +85°C
Extended (E1) -25°C to +75°C -30°C to +85°C
Industrial grade (E2) -40°C to +85°C -40°C to +85°C
Standard modules are available for commercial grade temperature range. Please see
chapter Product Specification for available variants for extended or industrial temperate
grade
With Kontron heatspreader plate assembly
The operating temperature defines two requirements:
» the maximum ambient temperature with ambient being the air surrounding the module.
» the maximum measurable temperature on any spot on the heatspreader's surface
Without Kontron heatspreader plate assembly
The operating temperature is the maximum measurable temperature on any spot on the module's surface.
3.6.2 Humidity
» Operating: 10% to 90% (non condensing)
» Non operating: 5% to 95% (non condensing)
22
- COMe-bPC2 1
- » Table of Contents « 3
- 1 User Information 6
- 1.5 Warranty 7
- 1.6 Technical Support 7
- 2 Introduction 8
- COMe-bPC2 / Introduction 9
- 2.5 COM Express® Benefits 10
- 3 Product Specification 11
- Accessories 12
- 3.2 Functional Specification 13
- GMCH and IOH specifications 14
- Graphics Core 15
- Connectivity 16
- Misc Interfaces and Features 16
- Kontron Features 16
- Power Features 17
- Supported Operating Systems 17
- 3.3 Block Diagram 18
- 3.4 Electrical Specification 19
- 3.4.5 ATX Mode 20
- 3.4.6 Single Supply Mode 20
- 3.5 Power Control 21
- 3.6.2 Humidity 22
- CE marking 23
- WEEE Directive 23
- Conformal Coating 23
- Shock & Vibration 24
- 3.8 MTBF 25
- 3.9 Mechanical Specification 26
- 3.10 Module Dimensions 26
- 3.10.2 38009-XXXX-XX-X 27
- 3.11 Thermal Management 28
- 3.12 Heatspreader 28
- 3.13 Onboard Fan Connector 29
- 4 Features and Interfaces 31
- 4.3 LPC boot 33
- 4.4 M.A.R.S 34
- 4.5 Fast I2C 35
- 4.6 JIDA16 and JIDA32 36
- 4.7 K-Station 1 37
- 4.8.1 I2C 38
- 4.8.2 Storage 38
- 4.8.3 GPIO 38
- 4.8.4 Hardware Monitor 38
- Configuration 39
- 4.10 Watchdog Timer 40
- 4.11 Flash Backup Feature 41
- 4.12 Speedstep Technology 43
- 4.13 C-States 44
- 4.15 VID-x 46
- 4.20 Display Configurations 50
- DDI Design Consideration 51
- Requirements 52
- Setup a Multi-monitor system 52
- 4.22 Intel® vPro™ technology 54
- 5 System Ressources 56
- 5.1.2 In APIC mode 57
- COMe-bPC2 / System Ressources 58
- 6 Connectors 59
- 7 Pinout List 60
- 7.2 Connector X1A Row A 61
- COMe-bPC2 / Pinout List 62
- 7.3 Connector X1A Row B 63
- 7.4 Connector X1B Row C 65
- 7.5 Connector X1B Row D 67
- 8 BIOS Operation 69
- 8.3 Setup Guide 70
- 8.4 BIOS Setup 72
- 8.4.2 Module Info 73
- Module Software Revisions 74
- Current LVDS Configuration 74
- Memory Module Information 75
- 8.4.3 Advanced Menu 76
- CPU Configuration 77
- IDE Configuration 78
- IDE Device Submenu 79
- AHCI Configuration 80
- AHCI PortN Submenu 81
- SuperIO Configuration 82
- Floppy Configuration Submenu 83
- ACPI Configuration 84
- ACPI Cooling Options 85
- PCIExpress Configuration 87
- USB Configuration 88
- COMe-bPC2 / BIOS Operation 89
- Hardware Health 90
- Baseboard Hardware Health 92
- Miscellaneous Settings 93
- Event Log Configuration 94
- MARS Interface Configuration 95
- Watchdog 96
- I2C Busses 97
- Remote Access Configuration 98
- Ethernet Configuration 99
- Features 100
- ME Subsystem Configuration 101
- Intel VT-d Configuration 102
- Trusted Computing 103
- 8.4.4 PCIPnP Menu 104
- 8.4.5 Boot 105
- Boot Setting Configuration 106
- 8.4.6 Security 107
- 8.4.7 Chipset 108
- North Bridge Configuration 109
- Display Control 110
- Internal LVDS Configuration 111
- Southbridge Configuration 112
- LPC Decode Range 113
- 8.4.8 Exit Menu 114
- Corporate Offices 115
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